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  • SiC Focus Rings

    SiC Focus Rings

    Semicorex advanced, high-purity SiC Focus Rings are built to withstand the extreme environments in plasma etch (or dry etch) chambers. We focus on semiconductor industries such as silicon carbide layers and epitaxy semiconductor. Our products have a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner in China.
  • CVD SiC Focus Ring

    CVD SiC Focus Ring

    Through a process of chemical vapor deposition (CVD), Semicorex CVD SiC Focus Ring is meticulously deposited and mechanically processed to achieve the final product. With its superior material properties, it's indispensable in the demanding environments of modern semiconductor fabrication.**
  • Si3N4 Seal Ring

    Si3N4 Seal Ring

    The Si3N4 Seal Ring from Semicorex represents a significant advancement in ceramic engineering, crafted from Si3N4, an exceptional inorganic material. This ceramic is renowned for its unique property of not shrinking during the sintering process, ensuring dimensional stability and consistency.
  • 6 inch SiC Boat

    6 inch SiC Boat

    Semicorex 6 Inch SiC Boat is a high-performance wafer carrier made from silicon carbide, designed for use in high-temperature semiconductor processes such as oxidation and diffusion. Semicorex provides superior-quality products with exceptional thermal stability, excellent chemical resistance, and a commitment to reliable, long-lasting performance in demanding semiconductor applications.*
  • Insulation Felt

    Insulation Felt

    Semicorex Insulation Felt for long crystal growth barrels is an essential component for manufacturers seeking to improve crystal yield, quality, and operational efficiency. Combining advanced material science with practical performance, it stands as a reliable solution for high-demand thermal management applications.*
  • Silicon Wafer Boat

    Silicon Wafer Boat

    Semicorex Silicon Wafer Boat is a high-purity carrier designed for semiconductor high-temperature furnaces, supporting wafers during oxidation and reduction processes at 1200–1250 °C. Semicorex provide superior products, ultra-clean performance, and reliable results that directly enhance device yield.*
  • Related Blog
  • Reviews

  • What is the process of SiC epitaxial?

    In the high voltage field, particularly for high-voltage devices above 20,000V, the SiC epitaxial technology still faces several challenges. One of the main difficulties is achieving high uniformity, thickness, and doping concentration in the epitaxial layer. For the fabrication of such high-voltage devices, a 200um thick silicon carbide epitaxial wafer with excellent uniformity and concentration is required.

  • Taiwan's PSMC to Build 300mm Wafer Fab in Japan

    Taiwan's Power Semiconductor Manufacturing Corporation (PSMC) has announced plans to build a 300mm wafer fab in Japan in collaboration with SBI Holdings. The purpose of this collaboration is to strengthen Japan's domestic IC (integrated circuit) supply chain, with a particular focus on circuits for AI edge computing and packaging technologies.

  • SiC Epitaxy

    There are two types of epitaxy: homogeneous and heterogeneous. In order to produce SiC devices with specific resistance and other parameters for different applications, the substrate must meet the conditions of epitaxy before production can begin. The quality of the epitaxy affects the device's performance.

  • Porous Graphite for SiC Crystal Growth

    Currently, most SiC substrate manufacturers use a new crucible thermal field process design with porous graphite cylinders: placing high-purity SiC particle raw materials between the graphite crucible wall and the porous graphite cylinder, while deepening the entire crucible and increasing the crucible diameter.

  • Difficulty in preparing SiC substrates

    At present, the most important direction trend of substrate development is to expand the diameter. The 6-inch mass production line in the global SiC market is maturing, and leading companies have entered the 8-inch market.

  • Why Use Ultrasonic Cleaning in Semiconductor Manufacturing

    When cleaning wafers, ultrasonic cleaning and megasonic cleaning are commonly used to remove particles from the wafer surface.

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