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    • China icp etch;Epitaxy Etch Carrier ICP PSS;Etch Carrier ICP PSS Gear Ring;SiC ceramic;silicon carbide part;ICP Etch System;Etching process;SiC plate;RBSiC;SSiC Manufacturers, Suppliers, Factory

    Semicorex has been producing icp etch;Epitaxy Etch Carrier ICP PSS;Etch Carrier ICP PSS Gear Ring;SiC ceramic;silicon carbide part;ICP Etch System;Etching process;SiC plate;RBSiC;SSiC for many years and is one of the professional icp etch;Epitaxy Etch Carrier ICP PSS;Etch Carrier ICP PSS Gear Ring;SiC ceramic;silicon carbide part;ICP Etch System;Etching process;SiC plate;RBSiC;SSiC manufacturers and Suppliers in China. Once you buy our advanced and durable products which supply bulk packing, we guarantee the large quantity in quick delivery. Over the years, we have provided customers with customized service. Customers are satisfied with our products and excellent service. We sincerely look forward to becoming your reliable long-term business partner! Welcome to buy products from our factory.

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    • TaC Coated Wafer Susceptor

      TaC Coated Wafer Susceptor

      Semicorex TaC Coated Wafer Susceptor is a crucial component used in Metal-Organic Chemical Vapor Deposition (MOCVD) furnaces for semiconductor epitaxial (epi) processing. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • Porous Graphite Crucible

      Porous Graphite Crucible

      Semicorex provide high-quality porous graphite crucible with customized service, our porous graphite material is top-notch quality with high specifications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • Support Crucible

      Support Crucible

      Semicorex Support Crucible stands as a pivotal component within the intricate process of solar silicon crystal growth, serving as a steadfast foundation for the transformation of raw materials into high-quality silicon ingots destined for photovoltaic applications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • Silicon Nitride Guide Roller

      Silicon Nitride Guide Roller

      Silicon Nitride Guide Roller by Semicorex represents a pinnacle in advanced ceramic engineering. This product offers a remarkable blend of mechanical, thermal, and electrical properties.**
    • Robot Hand

      Robot Hand

      Semicorex Robot Hand, a pivotal component within the Metal Organic Chemical Vapor Deposition (MOCVD) furnace, stands as a testament to precision engineering and advanced material science. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • SiC Disc Susceptor

      SiC Disc Susceptor

      Semicorex introduces its SiC Disc Susceptor, designed to elevate the performance of Epitaxy, Metal-Organic Chemical Vapor Deposition (MOCVD), and Rapid Thermal Processing (RTP) equipment. The meticulously engineered SiC Disc Susceptor provides with properties that guarantee superior performance, durability, and efficiency in high-temperature and vacuum environments.**
    • Related Blog
    • Reviews

    • Application Scenarios for Epitaxial Layers

      We know that further epitaxial layers need to be built on top of some wafer substrates for device fabrication, typically LED light-emitting devices, which require GaAs epitaxial layers on top of silicon substrates; SiC epitaxial layers are grown on top of conductive SiC substrates for building devices such as SBDs, MOSFETs, etc. for high voltage, high current and other power applications; GaN epitaxial layers are built on top of semi-insulating SiC substrates for building HEMTs and other RF applications.

    • Understanding Dry Etching Technology in the Semiconductor Industry

      Currently, many semiconductor devices employ mesa device structures, which are predominantly created through two types of etching: wet etching and dry etching. While the simple and rapid wet etching plays a significant role in semiconductor device fabrication, it has inherent drawbacks such as isotropic etching and poor uniformity, which result in limited control when transferring small-sized patterns. Dry etching, however, with its high anisotropy, good uniformity, and repeatability, has become prominent in semiconductor device fabrication processes. The term “dry etching” broadly refers to any non-wet etching technology used for removing surface materials and transferring micro and nano patterns, including laser etching, plasma etching, and chemical vapor etching. The dry etching discussed in this text specifically pertains to the narrow application of processes using plasma discharge—either physical or chemical—to modify material surfaces.

    • Various applications of quartz in semiconductor manufacturing

      At first glance, quartz (SiO2) material looks very similar to glass, but what is special is that ordinary glass is composed of many components (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.), while quartz only contains SiO2, and its microstructure is a simple network composed of silicon dioxide tetrahedral structural units.

    • Main steps in SiC substrate processing

      The processing of 4H-SiC substrate mainly includes the following steps:

    • Purification Technology of Graphite in SiC semiconductor

      Graphite is vital in producing Silicon Carbide (SiC) semiconductors, known for their exceptional thermal and electrical properties. This makes SiC ideal for high-power, high-temperature, and high-frequency applications. In SiC semiconductor manufacturing, graphite is commonly used for crucibles, heaters, and other high-temperature processing components due to its excellent thermal conductivity, chemical stability, and resistance to thermal shock.

    • What is quartz?

      Quartz (SiO₂) material is very similar to glass at first glance, but the special thing is that the general glass is made up of many components (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.), while the quartz contains only SiO₂ components, and the microstructure of its silicon dioxide tetrahedral structural units composed of a simple network.

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