Fused Quartz Ring

The Applications of Semicorex Fused Quartz Ring in Semiconductor Etching

The semiconductor etching process is a crucial step in the fabrication of semiconductor devices. During etching, specific areas of the wafer are selectively removed to create intricate patterns. This process requires materials that can withstand extreme conditions and provide consistent performance. The Fused Quartz Ring is engineered to meet these stringent requirements, ensuring that the etching process is precise, efficient, and reliable.

Advantages of Semicorex Fused Quartz Ring

1. Exceptional Purity

The purity of SiO2 in the Fused Quartz Ring is one of its most significant advantages. With purity levels ranging from 99.995% to 99.999%, the Fused Quartz Ring ensures minimal contamination and high-quality etching results. This high purity is crucial in semiconductor manufacturing, where even the smallest impurities can affect the performance and reliability of the final product.

2. Superior Thermal Stability

The Fused Quartz Ring is designed to withstand extreme temperatures, with an operating temperature of up to 1250°C and a softening temperature of 1730°C. This high thermal stability allows the Fused Quartz Ring to maintain its structural integrity and performance under the intense heat conditions commonly encountered in the etching process.

3. Low Coefficient of Expansion

The extremely low coefficient of expansion of the Fused Quartz Ring makes it highly resistant to thermal shock. This property is crucial in the etching process, where rapid temperature changes can occur. The low coefficient of expansion ensures that the Fused Quartz Ring remains stable and reliable, reducing the risk of cracking and other thermal stress-related issues.

4. Chemical Resistance

The Fused Quartz Ring exhibit excellent resistance to acids and alkalis. This chemical resistance ensures that the Fused Quartz Ring can withstand the harsh conditions of the etching process, maintaining their performance and durability over extended periods.

5. Micro Bubble Free and Low Hydroxyl Content

The absence of micro bubbles and low hydroxyl content in the Fused Quartz Ring ensures that they provide consistent and reliable performance. Micro bubbles and high hydroxyl content can lead to defects and contamination in the etching process, affecting the quality and reliability of the final product.

6. Low Thermal Conductivity and Dielectric Constant

The Fused Quartz Ring has very low thermal conductivity and dielectric constant, as well as the lowest loss tangent of almost all known materials. The low thermal conductivity helps to dissipate heat effectively, reducing the risk of thermal damage to the wafer. The low dielectric constant and loss tangent ensure that our quartz rings provide excellent electrical insulation, reducing the risk of electrical interference and improving the overall efficiency of the etching process.