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  • SiC Wafer Boat

    SiC Wafer Boat

    Semicorex provides wafer boats, pedestals, and custom wafer carriers for both vertical / column and horizontal configurations. We have been manufacturer and supplier of silicon carbide coating film for many years. Our SiC Wafer Boat has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • Solid Silicon Carbide Focusing Ring

    Solid Silicon Carbide Focusing Ring

    The Semicorex Solid Silicon Carbide Focusing Ring is a pivotal component in semiconductor manufacturing, strategically positioned outside the wafer to maintain direct contact. By utilizing an applied voltage, this ring focuses the plasma traversing it, thereby enhancing the process uniformity on the wafer. Constructed solely from Chemical Vapor Deposition Silicon Carbide (CVD SiC), this focus ring embodies the exceptional qualities demanded by the semiconductor industry. We at Semicorex are dedicated to manufacturing and supplying high-performance Solid Silicon Carbide Focusing Ring that fuse quality with cost-efficiency.
  • Aluminum Nitride Insulator Rings

    Aluminum Nitride Insulator Rings

    Semicorex Aluminum Nitride Insulator Rings are indispensable components in advanced semiconductor manufacturing, particularly in high-frequency heat treatment processes. Their unique combination of high-temperature stability, superior sealing properties, exceptional thermal conductivity, and inherent durability makes them essential for ensuring precise process control, high device yields, and extended equipment lifespan in the demanding environment of semiconductor fabrication. We at Semicorex are dedicated to manufacturing and supplying high-performance Aluminum Nitride Insulator Rings that fuse quality with cost-efficiency.**
  • Etching Ring

    Etching Ring

    The Etching Ring made of CVD SiC is an essential component in the semiconductor manufacturing process, offering exceptional performance in plasma etching environments. With its superior hardness, chemical resistance, thermal stability, and high purity, CVD SiC ensures that the etching process is precise, efficient, and reliable. By choosing Semicorex CVD SiC Etching Rings, semiconductor manufacturers can enhance the longevity of their equipment, reduce downtime, and improve the overall quality of their products.*
  • PFA Wafer Cassette

    PFA Wafer Cassette

    Semicorex PFA Wafer Cassette is a high-purity, chemically resistant solution designed to protect semiconductor wafers during processing, storage, and transportation. Choose Semicorex for our precision-engineered, durable products that ensure optimal wafer integrity and efficiency in semiconductor manufacturing.*
  • Wafer Edge Grinding Chuck

    Wafer Edge Grinding Chuck

    Semicorex Wafer Edge Grinding Chuck is a ceramic disk made from high-purity white alumina, designed for wafer edge grinding in semiconductor manufacturing. Choosing Semicorex ensures superior material quality, precision engineering, and reliable performance that support the most demanding wafer processing environments.*
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  • What is a semiconductor?

    Semiconductors are materials that guide electrical properties between conductors and insulators, with equal probability of loss and gain of electrons in the outermost layer of the atomic nucleus, and are easily made into PN junctions. Such as "silicon (Si)", "germanium (Ge)" and other materials.

  • Various applications of quartz in semiconductor manufacturing

    At first glance, quartz (SiO2) material looks very similar to glass, but what is special is that ordinary glass is composed of many components (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.), while quartz only contains SiO2, and its microstructure is a simple network composed of silicon dioxide tetrahedral structural units.

  • Defect-Free Epitaxial Growth and Misfit Dislocations

    Defect-free epitaxial growth occurs when one crystal lattice has nearly identical lattice constants to another. Growth happens when lattice sites of the two lattices at the interface region are approximately matched, which is possible with a small lattice mismatch (less than 0.1%). This approximate matching is achieved even with elastic strain at the interface, where each atom is slightly displaced from its original position in the boundary layer. While a small amount of strain is tolerable for thin layers and even desirable for quantum well lasers, the strain energy stored in the crystal is generally lowered by the formation of misfit dislocations, which involve a missing row of atoms in one lattice.

  • The Critical Role of SiC Substrates and Crystal Growth in the Semiconductor Industry

    Within the silicon carbide (SiC) industry chain, substrate suppliers hold significant leverage, primarily due to value distribution. SiC substrates account for 47% of the total value, followed by epitaxial layers at 23%, while device design and manufacturing constitute the remaining 30%. This inverted value chain stems from the high technological barriers inherent to substrate and epitaxial layer production. Three major challenges plague SiC substrate growth: stringent growth conditions, slow growth rates, and demanding crystallographic requirements. These complexities contribute to increased processing difficulty, ultimately resulting in low product yields and high costs. Furthermore, the epitaxial layer’s thickness and doping concentration are critical parameters directly impacting the final device performance.

  • Isostatic Graphite Production Technology

    Isostatic pressing technology is a critical process in the manufacturing of isostatic graphite, largely determining the performance of the final product. As such, comprehensive research and optimization of isostatic graphite production remain essential focal points in the industry.

  • How Are Ceramic Electrostatic Chucks Actually Produced?

    In semiconductor manufacturing, the precision and stability of the etching process are paramount. One critical factor in achieving high-quality etching is ensuring that wafers are perfectly flat on the tray during the process. Any deviation can lead to uneven ion bombardment, causing undesirable angles and variations in etching rates. To address these challenges, engineers have developed Electrostatic Chucks (ESCs), which have significantly improved etching quality and stability. This article delves into the design and functionality of ESCs, focusing on one key aspect: the electrostatic principles behind wafer adhesion.

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