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  • Susceptor LPE Blue Green LED

    • China Susceptor LPE Blue Green LED Manufacturers, Suppliers, Factory

    Semicorex has been producing Susceptor LPE Blue Green LED for many years and is one of the professional Susceptor LPE Blue Green LED manufacturers and Suppliers in China. Once you buy our advanced and durable products which supply bulk packing, we guarantee the large quantity in quick delivery. Over the years, we have provided customers with customized service. Customers are satisfied with our products and excellent service. We sincerely look forward to becoming your reliable long-term business partner! Welcome to buy products from our factory.

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    • SiC Coated RTP Carrier Plate for Epitaxial Growth

      SiC Coated RTP Carrier Plate for Epitaxial Growth

      Semicorex SiC Coated RTP Carrier Plate for Epitaxial Growth is the perfect solution for semiconductor wafer processing applications. With its high-quality carbon graphite susceptors and quartz crucibles processed by MOCVD on the surface of graphite, ceramics, etc., this product is ideal for wafer handling and epitaxial growth processing. The SiC coated carrier ensures high thermal conductivity and excellent heat distribution properties, making it a reliable choice for RTA, RTP, or harsh chemical cleaning.
    • SiC Epitaxy Susceptor

      SiC Epitaxy Susceptor

      Crafted with precision and engineered for reliability, SiC Epitaxy Susceptor features high corrosion resistance, high thermal conductivity, resistance to thermal shock, and high chemical stability, enabling it to function effectively within an epitaxial atmosphere.Therefore, SiC Epitaxy Susceptor is considered a core and crucial component in MOCVD equipment. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • ALD Planetary Susceptor

      ALD Planetary Susceptor

      Semicorex ALD Planetary Susceptor is important in ALD equipment due to their ability to withstand harsh processing conditions, ensuring high-quality film deposition for a variety of applications. As the demand for advanced semiconductor devices with smaller dimensions and enhanced performance continues to grow, the use of the ALD Planetary Susceptor in ALD is expected to expand further.**
    • SiN Ceramics Plain Substrates

      SiN Ceramics Plain Substrates

      SiN Ceramics Plain Substrates is a high-performance material known for its thermal stability, mechanical strength, electrical insulation, corrosion resistance, and dielectric properties. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • TaC Coated Tube

      TaC Coated Tube

      Semicorex TaC Coated Tube represents a pinnacle of material science, engineered to withstand the extreme conditions encountered in advanced semiconductor fabrication. Created by applying a dense, uniform layer of TaC onto a high-purity isotropic graphite substrate via Chemical Vapor Deposition (CVD), the TaC Coated Tube offers a compelling combination of properties that surpass conventional materials in demanding high-temperature and chemically aggressive environments.**
    • Aluminum Nitride Electrostatic Chucks

      Aluminum Nitride Electrostatic Chucks

      Semicorex Aluminum Nitride Electrostatic Chucks offer a compelling combination of properties that make them ideally suited for the demanding requirements of semiconductor wafer processing. Their ability to provide secure and uniform wafer clamping, excellent thermal management, and resistance to harsh processing environments translates into improved device performance, higher yields, and reduced manufacturing costs. We at Semicorex are dedicated to manufacturing and supplying high-performance Aluminum Nitride Electrostatic Chucks that fuse quality with cost-efficiency.**
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    • A Review of 9 Sintering Techniques for Silicon Carbide Ceramics

      Silicon carbide (SiC), a prominent structural ceramic, is renowned for its exceptional properties, including high-temperature strength, hardness, elastic modulus, wear resistance, thermal conductivity, and corrosion resistance. These attributes make it suitable for a wide range of applications, from traditional industrial uses in high-temperature kiln furniture, burner nozzles, heat exchangers, sealing rings, and sliding bearings, to advanced applications like ballistic armor, space mirrors, semiconductor wafer chucks, and nuclear fuel cladding.

    • Korean memory chips plummeted

    • What is graphitization degree?

      The degree of graphitization is an essential measure used to assess how close carbon atoms are to forming a tightly-packed hexagonal graphite crystal structure.

    • Demystifying Electrostatic Chuck (ESC) Technology in Wafer Handling

      Electrostatic chucks (ESCs) have become indispensable in semiconductor manufacturing and flat panel display production, offering a damage-free, highly controllable method for holding and positioning delicate wafers and substrates during critical processing steps. This article delves into the intricacies of ESC technology, exploring its principles of operation, various adhesion mechanisms, and fundamental structural components.

    • Application of SiC and GaN in electric vehicles

      SiC MOSFETs are transistors that offer high power density, improved efficiency, and low failure rates at high temperatures. These advantages of SiC MOSFETs bring numerous benefits to electric vehicles (EVs), including longer driving range, faster charging, and potentially lower cost battery electric vehicles (BEVs). Over the past five years, SiC MOSFETs have been widely used in the power electronics of EVs in vehicles from OEMs such as Tesla and Hyundai. In fact, SiC inverters accounted for 28% of the BEV market in 2023.

    • Substrate Cutting and Grinding Process

      SiC substrate material is the core of SiC chip. The production process of the substrate is: after obtaining the SiC crystal ingot through single crystal growth; then preparing the SiC substrate requires smoothing, rounding, cutting, grinding (thinning); mechanical polishing, chemical mechanical polishing; and cleaning, testing, etc. Process

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