Semicorex Alumina Ceramic Vacuum Chuck is applied in the wafer thinning and grinding processes of semiconductor manufacturing, serving as an indispensable tool for achieving high-precision and reliable semiconductor production.**
Semicorex Alumina Ceramic Vacuum Chuck plays an essential role in the wafer thinning and grinding phases of semiconductor manufacturing. These stages involve the meticulous reduction of wafer substrate thickness to enhance chip heat dissipation, which is vital for improving the efficiency and longevity of semiconductor devices. Thinning wafers to precise specifications is also crucial for facilitating advanced packaging techniques.
Compatibility with Multiple Wafer Sizes
The Alumina Ceramic Vacuum Chuck is designed to support a broad range of wafer sizes, including 2, 3, 4, 5, 6, 8, and 12 inches. This adaptability makes it suitable for a wide array of semiconductor production environments, ensuring consistent and reliable performance across different wafer dimensions.
Superior Material Composition
The base of the Alumina Ceramic Vacuum Chuck is constructed from ultra-pure 99.99% Alumina (Al2O3), which provides exceptional resistance to chemical attacks and thermal stability. The adsorption surface is made of porous silicon carbide (SiC). The compact and uniform structure of the porous ceramic material enhances its durability and performance.
Benefits of Micro-Porous Ceramic Technology
Enhanced Flatness and Parallelism: The micro-porous Alumina Ceramic Vacuum Chuck deliver exceptional flatness and parallelism, ensuring precise wafer handling and stability.
Optimal Porosity and Breathability: The well-distributed micro-pores provide superior air permeability and uniform adsorption force, leading to smooth and consistent operation.
Material Purity and Durability: Made from 99.99% pure Alumina, our Alumina Ceramic Vacuum Chuck is resistant to chemical attacks and offer remarkable thermal stability, making it suitable for demanding manufacturing environments.
Customizable Designs: We offer a variety of customizable shapes, including circular, square, looped, and L-shaped designs, with thickness options ranging from 3MM to 10MM. This customization ensures that our Alumina Ceramic Vacuum Chuck meets the specific needs of different semiconductor manufacturing processes.
Diverse Base Material Options: Based on the requirements for flatness and production costs, we provide recommendations for different base materials, such as SUS430 stainless steel, Aluminum Alloy 6061, dense Alumina ceramic (ivory color), granite, and dense silicon carbide ceramic. Each material is chosen to optimize the weight and performance of the Alumina Ceramic Vacuum Chuck.