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abide by the contract, conforms on the market requirement, joins from the market competition by its good quality likewise as provides more comprehensive and superb support for customers to let them become large winner. The pursue of the company, is definitely the clients' pleasure for alumina ceramic,wafer end effector,alumina ceramic arm in china,Wafer Handling,alumina ceramic manufacturers, We warmly welcome buddies from all walks of everyday living to hunt mutual cooperation and build a more brilliant and splendid tomorrow.
alumina ceramic, We rely on high-quality materials, perfect design, excellent customer service and the competitive price to win the trust of many customers at home and abroad. 95%products are exported to overseas markets.

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    Semicorex SiC Heater Silicon Carbide Heating Elements, is a specialized tool used in the handling and processing of semiconductor wafers. This crucial piece of equipment plays a pivotal role in creating the optimal thermal environment necessary for the production of high-quality semiconductor devices. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Alumina Chuck

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    Semicorex Alumina Chuck stands as a cornerstone tool within semiconductor processing, meticulously crafted from alumina ceramics. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Si Substrate

    Si Substrate

    Semicorex Si Substrate is designed with precision and reliability to meet the exacting standards of semiconductor manufacturing. Choosing Semicorex means choosing a substrate that is meticulously crafted to deliver consistent performance across all applications. Our Si Substrate undergo rigorous quality control, ensuring minimal impurities and defects, and are available in custom specifications to match the needs of cutting-edge technology.*
  • TaC Ring

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    Epitaxial wafer process is a critical technique used in semiconductor manufacturing. It involves the growth of a thin layer of crystal material on top of a substrate, which has the same crystal structure and orientation as the substrate. This process creates a high-quality interface between the two materials, allowing for the development of advanced electronic devices.

  • Dry Etching vs Wet Etching

    In semiconductor fabrication, etching is one of the major steps, along with photolithography and thin-film deposition. It involves removing unwanted materials from the surface of a wafer using chemical or physical methods. This step is carried out after coating, photolithography, and developing. It is used to remove the exposed thin film material, leaving only the desired portion of the wafer, and then removing the excess photoresist. These steps are repeated numerous times to create complex integrated circuits.

  • Coating in the thermal field of semiconductor silicon single crystals

    The coated parts in semiconductor silicon single crystal hot field are generally coated by CVD method, including pyrolytic carbon coating, Silicon Carbide coating and Tantalum Carbide coating, each with different characteristics.

  • Advantages and Disadvantages of Gallium Nitride (GaN) Applications

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