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    • China thin film deposition techniques Manufacturers, Suppliers, Factory

    Semicorex has been producing thin film deposition techniques for many years and is one of the professional thin film deposition techniques manufacturers and Suppliers in China. Once you buy our advanced and durable products which supply bulk packing, we guarantee the large quantity in quick delivery. Over the years, we have provided customers with customized service. Customers are satisfied with our products and excellent service. We sincerely look forward to becoming your reliable long-term business partner! Welcome to buy products from our factory.

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    • Tantalum Carbide Coated Graphite Parts

      Tantalum Carbide Coated Graphite Parts

      Semicorex provide high-quality Tantalum Carbide Coated Graphite Parts with customized service. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • 4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrate

      4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrate

      Semicorex provides various types of 4H and 6H SiC wafers. We have been manufacturer and supplier of wafer substrates for many years. Our 4 Inch High Purity Semi-Insulating HPSI SiC Double-side Polished Wafer Substrate has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
    • Pyrolytic Boron Nitride Heaters

      Pyrolytic Boron Nitride Heaters

      Semicorex Pyrolytic Boron Nitride Heaters represent the pinnacle of performance and reliability in the realm of high-temperature applications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • ZrO2 Crucible

      ZrO2 Crucible

      Semicorex ZrO2 Crucible is crafted from stabilized zirconia ceramic, presenting a standard composition of 94.7% zirconium dioxide (ZrO2) and 5.2% yttrium oxide (Y2O3) by weight percentage, or alternatively, 97% ZrO2 and 3% Y2O3 by mol percentage. This precise formulation endows the ZrO2 Crucible with a suite of advantageous characteristics that cater specifically to the demands of high-performance industrial processes.**
    • MOCVD SiC Coated Graphite Susceptor

      MOCVD SiC Coated Graphite Susceptor

      Semicorex MOCVD SiC Coated Graphite Susceptor is an advanced and specialized component used in the Metal-Organic Chemical Vapor Deposition process, a crucial technique in the production of semiconductors, optoelectronic devices, and other advanced materials. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
    • Tantalum Carbide Part

      Tantalum Carbide Part

      Semicorex Tantalum Carbide Part is a TaC-coated graphite component designed for high-performance use in silicon carbide (SiC) crystal growth applications, offering excellent temperature and chemical resistance. Choose Semicorex for reliable, high-quality components that enhance crystal quality and production efficiency in semiconductor manufacturing.*
    • Related Blog
    • Reviews

    • China remained the largest semiconductor equipment market

      Worldwide sales of semiconductor manufacturing equipment increased 5 percent from $102.6 billion in 2021 to an all-time record of $107.6 billion last year, SEMI, the industry association representing the global electronics design and manufacturing supply chain.

    • Thin film growth process

      Common thin films are mainly divided into three categories: semiconductor thin films, dielectric thin films, and metal/metal compound thin films.

    • Why choose liquid phase epitaxy method?

      Compared with the PVT method, the liquid phase method for growing SiC has the following advantages:

    • 4th Generation Semiconductors Gallium Oxide/β-Ga2O3

      The first generation of semiconductor materials is mainly represented by silicon (Si) and germanium (Ge), which began to rise in the 1950s. Germanium was dominant in the early days and was mainly used in low-voltage, low-frequency, medium-power transistors and photodetectors, but due to its poor high temperature resistance and radiation resistance, it was gradually replaced by silicon devices in the late 1960s. Silicon is still the main semiconductor material in the field of microelectronics due to its high technological maturity and cost advantages.

    • What is cantilever paddles?

      The wafer boats, loaded with a batch of wafers to be processed, are positioned on long cantilevered paddles.

    • Chip Manufacturing: Thin Film Processes

      The semiconductor thin film deposition process is an essential component of modern microelectronics technology. It involves constructing complex integrated circuits by depositing one or more thin layers of material on a semiconductor substrate.

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