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China Semiconductor Etching Carrier Manufacturers, Suppliers, Factory

owing to excellent support, a variety of top of the range items, aggressive rates and efficient delivery, we enjoy a very good reputation among our clients. We have been an energetic firm with wide market for Semiconductor Etching Carrier,Etch Carrier(ICP/PSS),SiC-Coated Plasma Etch Susceptor,SiC Etching Fixture,SiC Etching Solutions, We sincerely welcome domestic and foreign merchants who calls, letters asking, or to plants to negotiate, we will offer you quality products and the most enthusiastic service,We look forward to your visit and your cooperation.
Semiconductor Etching Carrier, Many products fully conform to the most rigorous of international guidelines and with our first-rate delivery service you will have them delivered at any time and in any place. And because Kayo deals in the entire spectrum of protective equipment, our customers don't have to waste time shopping around.

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  • SiC Boat for Wafer Handling

    SiC Boat for Wafer Handling

    Crafted from a silicon carbide of exceptional purity, the Semicorex SiC Boat for Wafer Handling boasts a construction that includes precision slots to secure the wafers, mitigating any movement during operational procedures. The choice of silicon carbide as the material ensures not only hardness and resilience but also the capability to endure elevated temperatures and exposure to chemicals. This makes the SiC Boat for Wafer Handling a pivotal component in a multitude of semiconductor production stages, such as the cultivation of crystals, diffusion, ion implantation, and etching processes.
  • TaC Coating Plate

    TaC Coating Plate

    Semicorex TaC Coating Plate stands out as a high-performance component for demanding epitaxial growth process and further semiconductor manufacturing environments.With its series of superior properties,it can ultimately enhance the productivity and cost-effectiveness of advanced semiconductor fabrication processes.**
  • Quartz Chamber

    Quartz Chamber

    Semicorex Quartz Chamber is an indispensable asset in the etching processes of semiconductor manufacturing and other high-tech industries. With its unique features and broad application range, it delivers superior performance and reliability. By choosing Semicorex’s Quartz Chamber, you are ensuring the highest quality etching results, backed by our unwavering commitment to innovation and customer support. Elevate your etching processes today with our advanced Quartz Chamber technology.*
  • CVD TaC Coating Cover

    CVD TaC Coating Cover

    Semicorex CVD TaC Coating Cover has been becoming a critical enabling technology in the demanding environments within epitaxy reactors, characterized by high temperatures, reactive gases, and stringent purity requirements, necessitate robust materials to ensure consistent crystal growth and prevent unwanted reactions.**
  • Isostatic Graphite Crucibles for Melting

    Isostatic Graphite Crucibles for Melting

    Semicorex Isostatic Graphite Crucibles for Melting are produced using isostatic pressing techniques, which enhance their material density and mechanical properties. This results in a vessel that not only withstands the extreme temperatures and corrosive environments typical of semiconductor processing but also offers long-term durability. The crucibles’ robustness ensures they can handle repeated thermal cycling without degradation, thereby providing consistent performance over extended operational periods. We at Semicorex are dedicated to manufacturing and supplying high-performance Isostatic Graphite Crucibles for Melting that fuse quality with cost-efficiency.
  • PBN Electrostatic Chuck

    PBN Electrostatic Chuck

    The PBN Electrostatic Chuck by Semicorex stands out in the field of wafer handling in semiconductor manufacturing due to its unique material properties.
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  • GaN and SiC: Coexistence or Substitution?

    The push for higher power density and efficiency has become a primary driver of innovation across multiple industries, including data centers, renewable energy, consumer electronics, electric vehicles, and autonomous driving technologies. In the realm of wide bandgap (WBG) materials, Gallium Nitride (GaN) and Silicon Carbide (SiC) are currently the two core platforms, viewed as pivotal tools leading power semiconductor innovation. These materials are profoundly transforming the power electronics industry to address the ever-increasing demand for power.

  • Semiconductor doping process

    One of the unique properties of semiconductor materials is that their conductivity, as well as their conductivity type (N-type or P-type), can be created and controlled through a process called doping. This involves introducing specialized impurities, known as dopants, into the material to form junctions on the surface of the wafer. The industry employs two main doping techniques: thermal diffusion and ion implantation.

  • Key Parameters of Silicon Carbide (SiC) Substrates

    The Silicon Carbide (SiC) production process encompasses the preparation of substrate and epitaxy from the materials side, followed by chip design and manufacturing, device packaging, and finally, distribution to downstream application markets. Among these stages, substrate material processing is the most challenging aspect of the SiC industry. SiC substrates are both hard and brittle, making cutting, grinding, and polishing extremely difficult. This increases the likelihood of defects during processing and reduces the yield rate. Currently, major international SiC manufacturers are planning to transition from 6-inch to 8-inch SiC wafers. Overcoming the challenges associated with 8-inch substrates has become a critical benchmark for the SiC industry. This article will introduce the key parameters of SiC substrates.

  • SiC Cutting

    Silicon carbide (SiC) is highly favored in the semiconductor industry for its excellent physical and chemical properties. However, the high hardness and brittleness of SiC pose considerable challenges to its processing.

  • Introduction to Silicon Carbide Power Devices

    Silicon carbide (SiC) power devices are semiconductor devices made of silicon carbide materials, mainly used in high-frequency, high-temperature, high-voltage and high-power electronic applications. Compared with traditional silicon (Si)-based power devices, silicon carbide power devices have higher bandgap width, higher critical breakdown electric field, higher thermal conductivity and higher saturated electron drift velocity, which makes them have great development potential and application value in the field of power electronics.

  • Knowing GaN

    Recently, the semiconductor industry has continued to pay increasing attention to Gallium Nitride (GaN) technology. Due to its excellent electronic properties, Gallium Nitride devices have important applications in many high-tech fields:

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