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Our company puts emphasis about the administration, the introduction of talented staff, along with the construction of employees building, seeking hard to boost the standard and liability consciousness of staff members members. Our business successfully attained IS9001 Certification and European CE Certification of si3n4,si3n4 sintering,sintered silicon nitride,hot pressed silicon nitride,lpcvd si3n4, Sincerely stay up for serving you from the in the vicinity of future. You are sincerely welcome to go to our company to talk company face to face with each other and create long-term co-operation with us!
si3n4, Being guided by customer demands, aiming at improving the efficiency and quality of customer service, we constantly improve products and provide more comprehensive services. We sincerely welcome friends to negotiate business and start cooperation with us. We hope to join hands with friends in different industries to create a brilliant future.

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  • High-purity Carbon Powder

    High-purity Carbon Powder

    Semicorex High-purity Carbon Powder serves as a crucial precursor in the synthesis of high-purity silicon carbide (SiC) powder and other solid-state carbide materials. It ensures the purity and quality required for advanced applications in the semiconductor, electronics, and ceramics industries. We at Semicorex are dedicated to manufacturing and supplying high-performance High-purity Carbon Powder that fuse quality with cost-efficiency.**
  • Solid Silicon Carbide Focusing Ring

    Solid Silicon Carbide Focusing Ring

    The Semicorex Solid Silicon Carbide Focusing Ring is a pivotal component in semiconductor manufacturing, strategically positioned outside the wafer to maintain direct contact. By utilizing an applied voltage, this ring focuses the plasma traversing it, thereby enhancing the process uniformity on the wafer. Constructed solely from Chemical Vapor Deposition Silicon Carbide (CVD SiC), this focus ring embodies the exceptional qualities demanded by the semiconductor industry. We at Semicorex are dedicated to manufacturing and supplying high-performance Solid Silicon Carbide Focusing Ring that fuse quality with cost-efficiency.
  • ICP Etching Plate

    ICP Etching Plate

    Semicorex ICP Etching Plate is an advanced, high-performance component specifically designed for semiconductor applications, crafted from Silicon Carbide (SiC) material. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China*.
  • Wafer Holder

    Wafer Holder

    Semicorex wafer holder iS critical component in semiconductor manufacturing and play a key role in ensuring accurate and efficient handling of wafers during the epitaxy process. We are firmly committed to providing the highest quality products at competitive prices and look forward to starting a business with you.*
  • Monocrystalline Silicon Wafer Susceptor

    Monocrystalline Silicon Wafer Susceptor

    Semicorex Monocrystalline Silicon Wafer Susceptor is the ideal solution for graphite epitaxy and wafer handling processes. Our ultra-pure product ensures minimal contamination and exceptional long-life performance, making it a popular choice in many European and American markets. As a leading provider of semiconductor wafer carriers in China, we look forward to becoming your long-term partner.
  • Soft Graphite Felt for Insulating

    Soft Graphite Felt for Insulating

    Semicorex provides high-quality soft graphite felt for insulating. We have been manufacturer and supplier of graphite materials for many years. Our soft graphite felt for insulating has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • Related Blog
  • Reviews

  • About defects in SiC crystals - Micropipe

    SiC substrate can have microscopic defects, such as Threading Screw Dislocation (TSD), Threading Edge Dislocation (TED), Base Plane Dislocation (BPD), and others. These defects are caused by deviations in the arrangement of atoms at the atomic level. SiC crystals may also have macroscopic dislocations, like Si or C inclusions, micropipe, hexagonal voids, polymorphs, etc. These dislocations are typically large in size.

  • Photovoltaic Industry Development Overview

    By 2027, solar photovoltaic (PV) will overtake coal as the world's largest installed capacity. The cumulative installed capacity of solar PV nearly triples in our forecast, growing by nearly 1,500 gigawatts over this period, and will surpass natural gas by 2026 and coal by 2027.

  • TaC coating with CVD method

    Tantalum carbide coating is an important high-strength, corrosion-resistant and chemically stable high-temperature structural material with a melting point of up to 4273 °C, one of the several compounds with the highest temperature resistance. It has excellent high-temperature mechanical properties, resistance to high-speed airflow scouring, ablation resistance, and good chemical and mechanical compatibility with graphite and carbon/carbon composites. Therefore, in the epitaxial process of GaN LEDs and SiC power devices such as MOCVD, TaC coating has excellent acid and alkali resistance to H2, HCl, NH3, which can completely protect the graphite substrate material and purify the growth environment.

  • LPE Apparatus

    In the realm of semiconductor device fabrication, the precise control of crystal growth is paramount for achieving high-quality and reliable devices. One technique that has played a pivotal role in this domain is Liquid-Phase Epitaxy (LPE).

  • Core Material for SiC Growth: Tantalum Carbide Coating

    The current third-generation semiconductors are primarily based on Silicon Carbide, with substrates accounting for 47% of device costs, and epitaxy accounting for 23%, totaling approximately 70% and forming the most crucial part of the SiC device manufacturing industry.

  • Demystifying Electrostatic Chuck (ESC) Technology in Wafer Handling

    Electrostatic chucks (ESCs) have become indispensable in semiconductor manufacturing and flat panel display production, offering a damage-free, highly controllable method for holding and positioning delicate wafers and substrates during critical processing steps. This article delves into the intricacies of ESC technology, exploring its principles of operation, various adhesion mechanisms, and fundamental structural components.

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