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Wafer Boat for Semiconductor Process
  • Wafer Boat for Semiconductor ProcessWafer Boat for Semiconductor Process
  • Wafer Boat for Semiconductor ProcessWafer Boat for Semiconductor Process
  • Wafer Boat for Semiconductor ProcessWafer Boat for Semiconductor Process
  • Wafer Boat for Semiconductor ProcessWafer Boat for Semiconductor Process
  • Wafer Boat for Semiconductor ProcessWafer Boat for Semiconductor Process

Wafer Boat for Semiconductor Process

Semicorex provides wafer boats, pedestals, and custom wafer carriers for both vertical / column and horizontal configurations. We have been manufacturer and supplier of silicon carbide coating film for many years. Our Wafer Boat for Semiconductor Process has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.

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Product Description

Semicorex SiC Wafer Boat for Semiconductor Process, the ultimate solution for wafer handling and protection in semiconductor manufacturing. Our wafer boat for semiconductor process is made from high-quality silicon carbide, which have good resistance to corrosion and excellent resistance to high temperatures and thermal shock. Advanced ceramics deliver excellent thermal resistance and plasma durability while mitigating particles and contaminants for high-capacity wafer carriers.


Parameters of Wafer Boat for Semiconductor Process

Technical Properties

Index

Unit

Value

Material Name

Reaction Sintered Silicon Carbide

Pressureless Sintered Silicon Carbide

Recrystallized Silicon Carbide

Composition

RBSiC

SSiC

R-SiC

Bulk Density

g/cm3

3

3.15 ± 0.03

2.60-2.70

Flexural Strength

MPa (kpsi)

338(49)

380(55)

80-90 (20°C) 90-100(1400°C)

Compressive Strength

MPa (kpsi)

1120(158)

3970(560)

> 600

Hardness

Knoop

2700

2800

/

Breaking Tenacity

MPa m1/2

4.5

4

/

Thermal Conductivity

W/m.k

95

120

23

Coefficient of Thermal Expansion

10-6.1/°C

5

4

4.7

Specific Heat

Joule/g 0k

0.8

0.67

/

Max temperature in air

1200

1500

1600

Elastic Modulus

Gpa

360

410

240


Features of Wafer Boat for Semiconductor Process

Superior heat resistance & thermal uniformity
Fine SiC crystal coated for a smooth surface
High durability against chemical cleaning
Material is designed so that cracks and delamination do not occur.



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