Semicorex SiC Wafer Boats are advanced component meticulously designed for semiconductor manufacturing, specifically in diffusion and thermal processes. With our steadfast commitment to providing top-quality products at competitive prices, we are ready to become your long-term partner in China.*
Semicorex SiC Wafer Boat, crafted from Silicon Carbide (SiC) ceramic, leads the way in meeting the demands of the semiconductor industry by delivering unparalleled performance in high-temperature environments. As the semiconductor industry relentlessly pushes the boundaries of microfabrication, the demand for resilient and robust materials becomes paramount.
The SiC Wafer Boat plays a crucial role in holding and supporting multiple wafers during thermal processes such as diffusion, oxidation, and chemical vapor deposition (CVD). These processes involve subjecting the wafers to extremely high temperatures, often exceeding 1000°C, in a controlled atmosphere. The uniformity and consistency of these thermal treatments are critical for ensuring the quality and performance of the semiconductor devices being manufactured. The ability of the SiC Wafer Boat to withstand such high temperatures without deformation or degradation ensures that the wafers are uniformly processed, leading to superior device yield and performance.
The exceptional thermal conductivity of the SiC wafer boats guarantees even heat distribution across all wafers, minimizing the risk of temperature gradients that could lead to defects in the semiconductor devices. Furthermore, SiC's low coefficient of thermal expansion (CTE) results in minimal thermal expansion and contraction during heating and cooling cycles. This stability is crucial for preventing mechanical stress and potential damage to the wafers, especially with shrinking device geometries.
During thermal processes, wafers are exposed to various reactive gases that can interact with the materials of the SiC wafer boat. SiC's excellent chemical resistance ensures that it does not react with these gases, preventing contamination and ensuring the purity of the wafers. This is particularly crucial in the production of advanced semiconductor devices, where even trace amounts of contamination can lead to defects and reduce device reliability.