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  • Wafer Edge Grinding Chuck

    Wafer Edge Grinding Chuck

    Semicorex Wafer Edge Grinding Chuck is a ceramic disk made from high-purity white alumina, designed for wafer edge grinding in semiconductor manufacturing. Choosing Semicorex ensures superior material quality, precision engineering, and reliable performance that support the most demanding wafer processing environments.*
  • Wafer Vacuum Chuck

    Wafer Vacuum Chuck

    Perfect for next-generation lithography and wafer-handling applications, Semicorex ultra-pure ceramic components ensure minimal contamination and provide exceptionally long life performance. Our Wafer Vacuum Chuck has a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner in China.
  • High-Purity Flexible Graphite Foil

    High-Purity Flexible Graphite Foil

    Semicorex high-purity flexible graphite foil is a versatile and high-performance material that can withstand extreme temperatures and challenging processes. Its ultra-high purity grades and unique properties make it an ideal solution for a wide range of high-temperature applications. We provide custom high-purity flexible graphite foil which has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • Baffle Wafer Boat

    Baffle Wafer Boat

    Semicorex Baffle Wafer Boat is a highly advanced piece of equipment used in semiconductor processing. It has been meticulously designed to ensure the delicate wafers are kept safe during the critical stages of production. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Coating Flat Susceptor

    SiC Coating Flat Susceptor

    Semicorex SiC Coating Flat Susceptor is a high-performance substrate holder designed for precise epitaxial growth in semiconductor manufacturing. Choose Semicorex for reliable, durable, and high-quality susceptors that enhance the efficiency and precision of your CVD processes.*
  • PSS Etching Carrier Tray for LED

    PSS Etching Carrier Tray for LED

    At Semicorex, we have designed the PSS Etching Carrier Tray for LED specifically for the harsh environments required for epitaxial growth and wafer handling processes. Our ultra-pure graphite carrier is ideal for thin-film deposition phases like MOCVD, epitaxy susceptors, pancake or satellite platforms, and wafer handling processing such as etching. The SiC coated carrier has high heat and corrosion resistance, excellent heat distribution properties, and a high thermal conductivity. Our PSS Etching Carrier Tray for LED is cost-effective and offer a good price advantage. We cater to many European and American markets and look forward to becoming your long-term partner in China.
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  • Different types of SiC ceramics

    Silicon carbide (SiC) ceramic is a type of advanced ceramic material known for its exceptional properties and wide range of applications. It is composed of silicon (Si) and carbon (C) atoms arranged in a crystal lattice structure, resulting in a hard and strong material with excellent thermal and electrical conductivity.

  • What are the technical difficulties of SiC crystal growth furnace

    The crystal growth furnace is the core equipment for the growth of Silicon Carbide crystals. It is similar to the traditional crystalline silicon-grade crystal growth furnace. The furnace structure is not very complicated. It is mainly composed of the furnace body, heating system, coil transmission mechanism, vacuum acquisition and measurement system, gas path system, cooling system, control system, etc. The thermal field and process conditions determine the key indicators such as the quality, size, and conductivity of the SiC crystal.

  • What are SiC-coated graphite susceptors?

    The tray (base) that supports SiC wafers, also known as a "susceptor," is a core component of semiconductor manufacturing equipment. And what exactly is this susceptor that carries the wafers?

  • Dry Etching vs Wet Etching

    In semiconductor fabrication, etching is one of the major steps, along with photolithography and thin-film deposition. It involves removing unwanted materials from the surface of a wafer using chemical or physical methods. This step is carried out after coating, photolithography, and developing. It is used to remove the exposed thin film material, leaving only the desired portion of the wafer, and then removing the excess photoresist. These steps are repeated numerous times to create complex integrated circuits.

  • Graphite products for vacuum furnace

    Graphite products are key and indispensable components in the semiconductor manufacturing process, including isostatic graphite, porous graphite, felt, etc.

  • Introducing Silicon Material

    Silicon is the second most abundant element on Earth after oxygen. Most silicon is found in soil, rocks, natural water, trees, and plants.

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