Semicorex TaC Tantalum Carbide Coated Plate is a cutting-edge solution designed to meet the stringent demands of semiconductor manufacturing, particularly in the epitaxial (epi) processing stage. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
Semicorex TaC Tantalum Carbide Coated Plate is a cutting-edge solution designed to meet the stringent demands of semiconductor manufacturing, particularly in the epitaxial (epi) processing stage. This specialized plate features a graphite base that is meticulously coated with Tantalum Carbide (TaC), forming a resilient and high-performance surface.
The primary purpose of the TaC Tantalum Carbide Coated Plate is to serve as a crucial component in semiconductor fabrication, where it plays a pivotal role in supporting and safeguarding wafers during high-temperature processes within a furnace. The TaC coating not only imparts exceptional heat resistance but also provides robust protection against corrosive chemical environments, ensuring the longevity and reliability of the plate in challenging semiconductor processing conditions.
In epi processing, where thin layers of semiconductor material are deposited onto a wafer's surface, the TaC Tantalum Carbide Coated Plate serves as a stable platform, effectively holding the wafer securely in place. The plate's thermal stability and resistance to chemical reactions make it an ideal choice for maintaining the integrity of the wafer and preventing contamination during the crucial manufacturing stages.
Key features of the TaC Tantalum Carbide Coated Plate include its exceptional thermal conductivity, resistance to chemical corrosion, and mechanical durability. These attributes collectively contribute to the plate's ability to endure extreme conditions, making it an indispensable component in the intricate and delicate processes of semiconductor fabrication.
Semicorex TaC Tantalum Carbide Coated Plate stands as an advanced solution that addresses the unique challenges of epi processing in semiconductor manufacturing. Its innovative design and material composition make it an essential tool for ensuring the precision and reliability of semiconductor devices, ultimately contributing to the advancement of technology in various applications.