TaC-coated Seal Ring

Semicorex TaC-coated Seal Ring applied to sealing components provides exceptional performance advantages in the demanding environments of semiconductor fabrication. TaC coating addresses critical challenges related to chemical resistance, extreme temperatures, and mechanical wear, enabling higher process yields, increased equipment uptime, and ultimately, lower manufacturing costs. We at Semicorex are dedicated to manufacturing and supplying high-performance TaC-coated Seal Ring that fuses quality with cost-efficiency.**

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Product Description

Semicorex TaC-coated Seal Ring exhibits outstanding inertness to a wide range of corrosive gases and chemicals employed in semiconductor processes, including plasma etch chemistries (e.g., fluorine, chlorine, bromine), dopants (e.g., boron, phosphorus, arsenic), and aggressive cleaning agents. This inertness prevents seal degradation and contamination of sensitive process chambers.

And with a melting point exceeding 3800°C, the TaC-coated Seal Ring maintains its structural integrity and mechanical strength at the elevated temperatures encountered during wafer processing. This ensures reliable sealing performance during high-temperature annealing, deposition, and etching processes.

The TaC-coated Seal Ring’s extreme hardness and low friction coefficient provide exceptional resistance to wear, scratching, and abrasion. This is critical in dynamic sealing applications where repeated motion or contact with wafers and other components can lead to particle generation and seal failure.

The TaC-coated Seal Ring exhibits very low outgassing rates, even at elevated temperatures, making them ideal for high-vacuum applications. This ensures process purity and prevents the deposition of unwanted contaminants on sensitive wafer surfaces.

Specific Benefits in Semiconductor Applications:

Extended Seal Lifetime: The TaC-coated Seal Ring significantly increases seal lifetime by providing superior resistance to chemical attack, thermal degradation, and mechanical wear. This reduces the frequency of seal replacements, minimizing downtime and maintenance costs.

Improved Process Yield and Wafer Quality: The inert nature of the TaC-coated Seal Ring minimizes particle generation and contamination, leading to higher process yields and improved wafer quality. This is critical for the production of high-performance semiconductor devices with stringent defect tolerances.

Enhanced Equipment Uptime and Productivity: Longer seal lifetimes and reduced maintenance requirements contribute to increased equipment uptime and overall productivity. This is crucial for maximizing output and meeting the demands of high-volume semiconductor manufacturing.