English
Home > Products > vacuum chamber furnace

China vacuum chamber furnace Manufacturers, Suppliers, Factory

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for vacuum chamber furnace,single crystalline silicon,wafer processing,annealing semiconductor,wafer diffusion process, If you're interested in any of our products and services, make sure you don't be reluctant to call us. We've been wanting to reply you within 24 several hours just after receipt of your respective ask for and to generate mutual un-limited positive aspects and enterprise in in the vicinity of long run.
vacuum chamber furnace, We give good quality but unbeatable low price and the best service. Welcome to post your samples and color ring to us .We are going to produce the items according to your request. If you are interested in any solutions we provide, remember to feel free to contact us directly by mail, fax, telephone or internet. We have been here to answer your questions from Monday to Saturday and looking forward to cooperating with you.

Related Products

Hot Products

  • SiC Susceptor for MOCVD

    SiC Susceptor for MOCVD

    Semicorex is a leading manufacturer and supplier of SiC Susceptor for MOCVD. Our product is specially designed to cater to the needs of the semiconductor industry in growing the epitaxial layer on the wafer chip. The product is used as the center plate in MOCVD, with a gear or ring-shaped design. It has high heat and corrosion resistance, making it ideal for use in extreme environments.
  • Silicon Film

    Silicon Film

    Semicorex Silicon Film, or silicon wafer, is a high-purity semiconductor substrate essential for applications in integrated circuits, solar cells, and MEMS devices. Semicorex expertise in precision manufacturing and stringent quality control ensures that our Silicon Film meets the highest industry standards, providing exceptional reliability and performance for advanced semiconductor applications.*
  • Bulk SiC Ring

    Bulk SiC Ring

    Semicorex Bulk SiC Ring is a crucial component in semiconductor etching processes, specifically designed for use as an etching ring within advanced semiconductor manufacturing equipment. With our steadfast commitment to providing top-quality products at competitive prices, we are ready to become your long-term partner in China.*
  • Alumina Vacuum Chucks

    Alumina Vacuum Chucks

    Semicorex Alumina Vacuum Chucks are precision-engineered components designed to securely hold wafers or substrates during critical semiconductor and precision manufacturing processes. With Semicorex's commitment to high-quality materials and cutting-edge manufacturing techniques, our Alumina Vacuum Chucks provide unmatched reliability, precision, and performance for your most demanding applications.*
  • CVD SiC Pancake Susceptor

    CVD SiC Pancake Susceptor

    Unleash the pinnacle of precision in semiconductor manufacturing with our cutting-edge CVD SiC Pancake Susceptor. This disc-shaped component, expertly designed for semiconductor equipment, serves as a crucial element for supporting thin semiconductor wafers during high-temperature epitaxial deposition processes. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Seal Parts

    SiC Seal Parts

    Semicorex SiC seal parts, or Silicon Carbide seal parts, represent a cutting-edge and highly efficient solution for various industrial applications where sealing integrity is paramount. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Related Blog
  • Reviews

  • Monocrystalline Silicon Manufacturing

    The three primary methods used in monocrystalline silicon manufacturing are the Czochralski (CZ) method, the Kyropoulos method, and the Float Zone (FZ) method.

  • Gallium Nitride Epitaxial Wafers: An Introduction to the Fabrication Process

    Gallium Nitride (GaN) epitaxial wafer growth is a complex process, often utilizing a two-step method. This method involves several critical stages, including high-temperature baking, buffer layer growth, recrystallization, and annealing. By meticulously controlling the temperature throughout these stages, the two-step growth method effectively prevents wafer warping caused by lattice mismatch or stress, making it the predominant fabrication method for GaN epitaxial wafers globally.

  • Application of GaN

    There are many types of gallium nitride (GaN), with silicon-based GaN being the most discussed. This technology involves growing GaN materials directly on a silicon substrate.

  • Silicon Carbide Applications

    Silicon carbide has a large number of applications in emerging industries and traditional industries. At present, the global semiconductor market has exceeded 100 billion yuan. It is expected that by 2025, the global sales of semiconductor manufacturing materials will reach 39.5 billion US dollars, of which the silicon carbide semiconductor market is expected to reach a market size of 2.5 billion US dollars in 2025. At the same time, silicon carbide is still the material with the best application performance in traditional ceramics, refractory, high temperature, grinding and other fields.

  • Why choose SiC-coated graphite susceptors?

    Graphite susceptor is one of the essential parts in the MOCVD equipment, is the carrier and the heater of the wafer substrate. Its properties of thermal stability and thermal uniformity play a decisive role in the quality of wafer epitaxial growth, which directly determines the uniformity and purity of the layer materials, in a result its quality directly affects the preparation of epitaxy.

  • Advantages and Disadvantages of Gallium Nitride (GaN) Applications

    As the world looks for new opportunities in semiconductors, gallium nitride continues to stand out as a potential candidate for future power and RF applications. However, for all the benefits it offers, it still faces a major challenge; there are no P-type (P-type) products. Why is GaN touted as the next major semiconductor material, why is the lack of P-type GaN devices a major drawback, and what does this mean for future designs?

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept