China CVD TaC coating Manufacturers, Suppliers, Factory

In their newly released annual report, TSMC Chairman Deyin Liu and CEO Chieh-Jia Wei revealed the progress related to the 2nm process.

Graphite susceptor is one of the essential parts in the MOCVD equipment, is the carrier and the heater of the wafer substrate. Its properties of thermal stability and thermal uniformity play a decisive role in the quality of wafer epitaxial growth, which directly determines the uniformity and purity of the layer materials, in a result its quality directly affects the preparation of epitaxy.

Compared with the PVT method, the liquid phase method for growing SiC has the following advantages:

In the realm of semiconductor device fabrication, the precise control of crystal growth is paramount for achieving high-quality and reliable devices. One technique that has played a pivotal role in this domain is Liquid-Phase Epitaxy (LPE).

The Silicon Carbide (SiC) production process encompasses the preparation of substrate and epitaxy from the materials side, followed by chip design and manufacturing, device packaging, and finally, distribution to downstream application markets. Among these stages, substrate material processing is the most challenging aspect of the SiC industry. SiC substrates are both hard and brittle, making cutting, grinding, and polishing extremely difficult. This increases the likelihood of defects during processing and reduces the yield rate. Currently, major international SiC manufacturers are planning to transition from 6-inch to 8-inch SiC wafers. Overcoming the challenges associated with 8-inch substrates has become a critical benchmark for the SiC industry. This article will introduce the key parameters of SiC substrates.

Wafer cleaning refers to the process of removing particulate contaminants, organic contaminants, metal contaminants, and natural oxide layers from the wafer surface using physical or chemical methods before semiconductor processes such as oxidation, photolithography, epitaxy, diffusion, and wire evaporation. In the semiconductor manufacturing, the yield rate of semiconductor devices largely depends on the cleanliness of the semiconductor wafer surface. Therefore, to achieve the cleanliness required for semiconductor manufacturing, the rigorous wafer cleaning processes are essential.