Why Use Ultrasonic Cleaning in Semiconductor Manufacturing

Contamination of chips, shells, substrates, etc. can be caused by factors such as clean rooms, contact materials, process equipment, introduction of personnel, and the manufacturing process itself. When cleaning wafers, ultrasonic cleaning and megasonic cleaning are commonly used to remove particles from the wafer surface.

Ultrasonic cleaning is a process that uses high-frequency vibration waves (usually above 20kHz) to clean materials and surfaces. Ultrasonic cleaning produces "cavitation" in the cleaning fluid, that is, the generation and rupture of "bubbles" in the cleaning fluid. When "cavitation" reaches the moment of rupture on the surface of the object being cleaned, it generates an impact force far exceeding 1000 atmospheres, causing the dirt on the surface of the object and the dirt in the gaps to be hit, ruptured and peeled off, so that the object is cleaned. These shock waves produce a scrubbing effect, which can effectively remove pollutants such as dirt, grease, oil and other residues on the surface.

Cavitation refers to the formation, growth, oscillation or explosion of bubbles due to the continuous compression and rarefaction of the liquid medium under ultrasonic propagation.

Ultrasonic cleaning technology mainly uses low-frequency and high-frequency vibrations in the fluid to form bubbles, thereby producing the "cavitation effect.

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