TSMC: 2nm process risk trial production next year

In their newly released annual report, TSMC Chairman Deyin Liu and CEO Chieh-Jia Wei revealed the progress related to the 2nm process.
According to the letter to shareholders, they have increased their R&D efforts in the last year, working on technology, especially the 2nm process, spending $5.47 billion on R&D to expand their technology leadership and differentiation.
For the 2nm process, TSMC will use a nanosheet transistor structure with improved performance and energy efficiency. Compared to the N3E process, the 2nm process will increase speed by 10%-15% at the same power consumption or reduce power consumption by 25%-30% at the same speed to meet the growing demand for energy-efficient computing.
Currently, the development of the 2nm process is progressing as planned, with risky pilot production in 2024 and mass production in 2025.