Begin Production of 3C-SiC Wafer

The thermal conductivity of bulk 3C-SiC, recently measured, is the second-highest among inch-scale large crystals, ranking just below diamond. Silicon carbide (SiC) is a wide bandgap semiconductor extensively used in electronic applications, and it exists in various crystalline forms known as polytypes. Managing high localized heat flux is a significant challenge in power electronics, as it can lead to device overheating and long-term performance and reliability issues.

High thermal conductivity materials are crucial in thermal management design to address this challenge effectively. The most commonly used and studied SiC polytypes are the hexagonal phase (6H and 4H), while the cubic phase (3C) is less explored, despite its potential for excellent electronic properties.

The measured thermal conductivity of 3C-SiC has been puzzling as it falls below the structurally more complex 6H-SiC phase and even lower than the theoretically predicted value. Actually, contained in the 3C-SiC crystals cause extreme resonant phonon scattering, which significantly lowers its thermal conductivity. High thermal conductivity from the high purity and high crystal quality 3C-SiC crystals.

Remarkably, 3C-SiC thin films grown on Si substrates exhibit record-high in-plane and cross-plane thermal conductivity, surpassing even diamond thin films of equivalent thicknesses. This study ranks 3C-SiC as the second-highest thermal conductivity material among inch-scale crystals, second only to single-crystal diamond, which boasts the highest thermal conductivity among all natural materials.

The cost-effectiveness, ease of integration with other materials, and the ability to grow large wafer sizes make 3C-SiC a highly suitable thermal management material and an exceptional electronic material with high thermal conductivity for scalable manufacturing. The unique combination of thermal, electrical, and structural properties of 3C-SiC has the potential to revolutionize the next generation of electronics, serving as active components or thermal management materials to facilitate device cooling and reduce power consumption. The applications that can benefit from 3C-SiC's high thermal conductivity include power electronics, radio-frequency electronics, and optoelectronics.

We are pleased to inform you that Semicorex has begun production of 4-inch 3C-SiC wafers. If you have any questions or require further information, please feel free to contact us.

Contact phone # +86-13567891907

Email: sales@semicorex.com